Electron beam lithography system and method for improving throughput

ABSTRACT

An electron beam lithography method and apparatus for improving throughput is disclosed. An exemplary lithography method includes receiving a pattern layout having a pattern layout dimension; shrinking the pattern layout dimension; and overexposing a material layer to the shrunk pattern layout dimension, thereby forming the pattern layout having the pattern layout dimension on the material layer.

BACKGROUND

Microfabrication conventionally uses photolithography or opticallithography processes for selectively removing parts of a substrate, orparts of a material layer on the substrate. For example,photolithography uses a directed light (radiation) source to transfer apattern from a photomask (also referred to as a mask or reticle) to alight-sensitive resist material formed on the substrate or materiallayer, thereby generating an exposure pattern in the resist material.Chemical treatments may then be used to etch or otherwise transfer theexposure pattern in the resist material to the substrate or materiallayer. More recently, microfabrication has implemented other lithographytypes, such as charged particle beam lithography, that do notnecessitate the intermediary step of creating the mask to transfer orgenerate an exposure pattern in a resist material. For example, electronbeam (e-beam) lithography uses a focused beam of electrons to expose theresist material. Instead of using a mask, e-beam lithography “writes” apattern directly into an energy-sensitive resist material using electronbeams. An e-beam exposure tool generally writes the pattern from anelectronic or computer-type file, which is used to control an exposuresource of the e-beam exposure tool. The exposure source may beselectively directed onto the substrate, material layer, or resistmaterial to be patterned. More particularly, the e-beam exposure tool isgenerally configured such that exposing a circuit pattern is notaccomplished by illuminating the resist material through a mask or filmnegative of the circuit, but rather by directly and selectively exposingdesired areas of the resist material or material layer on the substratewith a focused beam of an appropriate energy and dosage for creating thedesired circuit pattern. E-beam lithography is particularly useful asdevice dimensions continually scale down. Its usefulness is limited bythroughput (the time it takes to expose an entire wafer). For example,as device dimensions decrease and pattern densities of a pattern to bewritten increase, higher beam currents are typically used to write thepattern. However, it has been observed that higher beam currents mayinduce undesirable Coulomb effects, requiring increases in writing timeto thwart such effects. Accordingly, although existing e-beamlithography systems and methods have been generally adequate for theirintended purposes, they have not been entirely satisfactory in allrespects.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a flowchart of a lithography method according to variousaspects of the present disclosure.

FIG. 2 is a flow chart of a method for shrinking a pattern layoutdimension of a pattern layout that can be implemented by the lithographymethod of FIG. 1 according to various aspects of the present disclosure.

FIG. 3 illustrates a portion of a pattern layout that can be formedaccording to the method 100 of FIG. 1.

FIG. 4 illustrates a portion of a pattern layout that can be formedaccording to the method 100 of FIG. 1.

FIG. 5 illustrates a portion of a pattern layout that can be formedaccording to the method 100 of FIG. 1.

FIG. 6 illustrates a portion of a pattern layout that can be formedaccording to the method 100 of FIG. 1.

FIG. 7 is a simplified block diagram of a lithography apparatus that canimplement the lithography method of FIG. 1 according to various aspectsof the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

FIG. 1 is a flow chart of a lithography method 100 according to variousaspects of the present disclosure. In the depicted embodiment, thelithography method 100 is a charged particle beam lithography method,specifically an electron beam lithography method. The lithography method100 can be implemented to write a pattern, such as an integrated circuitpattern, on a wafer. The wafer is a semiconductor substrate, a maskblank, a glass substrate, a flat panel substrate, or other suitablesubstrate. The wafer may include a recording medium, such as an energysensitive resist (or material) layer, formed thereon. FIG. 1 has beensimplified for the sake of clarity to better understand the inventiveconcepts of the present disclosure. Additional steps can be providedbefore, during, and after the method 100, and some of the stepsdescribed can be replaced or eliminated for other embodiments of themethod.

At block 110, a pattern layout is received, for example, by an electronbeam lithography apparatus. The pattern layout may be presented in oneor more data files having information of a pattern to be fabricated. Thepattern layout can be expressed in a GDSII file format, a DFII fileformat, or other suitable file format. In the depicted embodiment, thepattern layout is an integrated circuit (IC) design layout. The ICdesign layout includes one or more features based on a specification ofan IC device (product) to be manufactured. The features have variousgeometrical patterns designed for the IC device. The various geometricalpatterns typically correspond to patterns of various conductor,insulator, and/or semiconductor layers that combine to form various ICfeatures/components of the IC device, such as an active region, a gateelectrode, a source and drain, a multilayer interconnection (MLI), abonding pad opening, other suitable features/components, or combinationsthereof.

The pattern layout has a pattern layout dimension. For example, thepattern layout has a critical dimension, defined as a dimension of apattern feature (for example, a line width or a line length) or a spacebetween two pattern features (for example, between two lines). Thecritical dimension contributes to overall pattern layout size andpattern layout density. A minimum critical dimension associated with thepattern layout can be defined as the smallest dimension of a patternfeature of the pattern layout, or the smallest space between two patternfeatures of the pattern layout. In the depicted embodiment, each featureof the pattern layout has a dimension or size, such as a length and awidth. Each feature may have a dimension that is greater than or equalto the critical dimension(s) of the pattern layout.

The pattern layout also has an exposure dose associated therewith. Inthe depicted embodiment, the exposure dose includes an electron beamenergy and an exposure time. When an electron beam lithography apparatusexposes a material layer to the pattern layout using the exposure dose,the pattern layout having the pattern layout dimension is formed on thematerial layer. Accordingly, the material layer includes the variousfeatures of the pattern layout, where dimensions of the various featuresformed on the material layer have the same dimensions as the variousfeatures of the pattern layout (in its file format).

At block 120, the pattern layout dimension of the pattern layout isshrunk. Shrinking the pattern layout dimension involves reducing thepattern layout's pattern density. In an example, the pattern layout'scritical dimension is reduced, such that the pattern layout's patterndensity is reduced. FIG. 2 is a flow chart that illustrates a method forshrinking the pattern layout dimension of the pattern layout. In thedepicted embodiment, the shrinking method is implemented by block 120 ofthe method 100 of FIG. 1. In FIG. 2, at block 122, the criticaldimension of the pattern layout is evaluated to determine whether thecritical dimension is greater than or equal to a threshold value. Thethreshold value is any suitable value. For example, the threshold valuemay be less than two times the minimum critical dimension of the patternlayout. The threshold value may be based on various parameters, such asa pixel size or sizes registered in an electron beam lithographyapparatus or the various process conditions related to forming thepattern layout on a material layer.

If the critical dimension is less than the threshold value, at block124, the pattern layout is biased to shrink its pattern layoutdimension. Since the pattern layout dimension is reduced, this may bereferred to as negatively biasing the pattern layout dimension. Asdescribed further below, biasing the pattern layout to shrink itspattern layout dimension may include reducing a size of the patternlayout's features. If the critical dimension is greater than or equal tothe threshold value, at blocks 126 and 128, the pattern layout isdecomposed to achieve a critical dimension that is less than thethreshold value, and the decomposed pattern layout is biased to shrinkits pattern layout dimension. In either situation, an electron proximitycorrection may be applied to the shrunk pattern layout, or shrunk anddecomposed pattern layout. The pattern layout having the shrunk patternlayout dimension may be referred to as a shrunk pattern layout, whichmay be presented in one or more data files.

In a more specific example, biasing the pattern layout involves reducingdimensions of the pattern layout's features, such that the patternlayout's pattern density is reduced. For example, a size of each featureis reduced to a pixel size registered in the electron beam lithographyapparatus. The pixel size may be about 0.1 to about 0.8 times theminimum critical dimension of the pattern layout. The dimensions of thepattern layout's features may be shrunk according to critical dimensionbiases of the features. Following the method illustrated in FIG. 2, eachfeature's size is evaluated to determine whether the size of the featureis greater than or equal to the threshold value. In the depictedembodiment, the threshold value is a threshold size. If the feature'ssize is less than the threshold size, then the feature is biased untilthe feature's size is about the pixel size registered in the electronbeam lithography apparatus. If the feature's size is greater than thethreshold size, then the feature is decomposed into more than onefeature portion. Each feature portion has a size smaller than or equalto the threshold size. The feature portions are then biased until eachfeature portion's size is about the pixel size registered in theelectron beam apparatus. In another example, a pattern layout may havefeatures having a same critical dimension, and each feature may bebiased (or have its size reduced) to various sizes according to eachfeature's surrounding environment (for example, according to whether thefeature is a dense line feature or an isolated line feature). In anotherexample, a pattern layout may have features having different criticaldimensions, and each feature may be biased (or have its size reduced) tovarious sizes according to each feature's critical dimension. Anelectron proximity correction may be applied to the shrunk, or shrunkand decomposed, features. The pattern layout having the shrunk, orshrunk and decomposed, pattern features may be referred to as a shrunkpattern layout, which may be presented in one or more data files.

At block 130, overexposing a material layer to the shrunk pattern layoutdimension of the pattern layout forms the pattern layout having thepattern layout dimension on the material layer. For example, an exposuredose that is higher than the exposure dose associated with the patternlayout (in its original pattern layout dimension) is used to write theshrunk pattern layout dimension of the pattern layout on the materiallayer. The higher exposure dose may be in the form of a higher electronbeam current. The shrunk pattern layout dimension of the pattern layoutmay be written using a raster scanning method or a vector scanningmethod. Using the higher exposure dose to write the shrunk patternlayout dimension of the pattern layout forms the pattern layout havingthe pattern layout dimension, as designed. Since the shrunk patternlayout dimension reduces actual pattern layout density exposed,throughput for forming the pattern layout may be improved.

FIGS. 3-6 illustrate various portions of a pattern layout that can beformed on a material layer using the method 100 of FIG. 1. As describedbelow, the various portions of the pattern layout are biased, ordecomposed and biased, to reduce a pattern density of the patternlayout. The biased, and/or decomposed and biased portions, can then bewritten on the material layer using an overexposure, specifically anincreased beam current, to form the pattern layout. Actual patterndensity of the pattern layout exposed by a charged particle beam is thusreduced, thereby decreasing throughput. Accordingly, though a patternlayout's pattern density may increase, the disclosed method improvesthroughput by decreasing the actual pattern density exposed. Differentembodiments may have different advantages, and no particular advantageis necessarily required of any embodiment.

FIG. 3 illustrates a portion 200 of a pattern layout that is formed on amaterial layer according to the method 100 of FIG. 1. In FIG. 3, thepattern layout includes a pattern feature 202. The pattern feature 202has a dimension, such as a length (L₂₀₂) and a width (W₂₀₂). In thedepicted embodiment, W₂₀₂ equals a minimum critical dimension of thepattern layout. An exposure dose is associated with the pattern feature202 that ensures that the pattern feature 202 is written on a materiallayer with the dimensions as designed, such as with L₂₀₂ and W₂₀₂. Thepattern feature 202 is evaluated using block 120 of the method 100 ofFIGS. 1 and 2. In the depicted embodiment, W₂₀₂ is less than apredetermined threshold size (block 122 of FIG. 2), so the patternfeature 202 is biased to shrink the width, W₂₀₂, of the pattern feature202 (block 124 of FIG. 2). For example, the pattern feature 202 isnegatively biased to provide a shrunk pattern feature 206. The shrunkpattern feature 206 has a dimension that is smaller than the dimensionof pattern feature 202. Specifically, the shrunk pattern feature 206 hasa width (W₂₀₆) that is smaller than W₂₀₂ of the pattern feature 202.W₂₀₆ is about a pixel size registered in an electron beam lithographyapparatus, such as the electron beam lithography apparatus that will beused to form the pattern feature 202 on a material layer. The shrunkpattern feature 206 also has a length (L₂₀₆). L₂₀₆ is about equal toL₂₀₂. An electron proximity correction (EPC) may be performed on theshrunk pattern feature 206, thereby providing a biased/EPCed patternfeature 210. The biased/EPCed pattern feature 210 (or alternatively, thebiased pattern feature 206) is then written on a material layer using anexposure does that is greater than the exposure dose associated with thepattern feature 202. In other words, an overexposure is used to writethe biased/EPCed pattern feature 210 (or the biased pattern feature 206)on the material layer, thereby forming pattern feature 214 on thematerial layer. The pattern feature 214 corresponds with the patternfeature 202. More specifically, the pattern feature 214 has a dimension,specifically a length (L₂₁₄) and a width (W₂₁₄), that is substantiallyequivalent to the dimension, L₂₀₂ and W₂₀₂, of pattern feature 202. Thepattern feature 202 is thus formed on the material layer by overexposingthe material layer to pattern feature 210, which has a smaller dimensionthan the pattern feature 202.

FIG. 4 illustrates a portion 300 of a pattern layout that is formed on amaterial layer according to the method 100 of FIG. 1. In FIG. 4, thepattern layout includes a pattern feature 302. The pattern feature 302has a dimension, such as a length (L₃₀₂) and a width (W₃₀₂). In thedepicted embodiment, W₃₀₂ is greater than a minimum critical dimensionof the pattern layout. An exposure dose is associated with the patternfeature 302 that ensures that the pattern feature 302 is written on amaterial layer with the dimension, L₃₀₂ and W₃₀₂. In the depictedembodiment, the pattern feature 302 is evaluated using block 120 of themethod 100 of FIGS. 1 and 2. In the depicted embodiment, W₃₀₂ is greaterthan a predetermined threshold size (block 122 of FIG. 2), so thepattern feature 302 is decomposed and biased to shrink the dimension ofthe pattern feature 302 (blocks 126 and 128 of FIG. 2). For example, thepattern feature 302 is decomposed into a feature 306 that includesfeature portions 306 ₁, 306 ₂, 306 ₃, . . . 306 _(N). Each featureportion 306 ₁, 306 ₂, 306 ₃, . . . 306 _(N) has a dimension, such as alength (L₃₀₆) and a width (W₃₀₆). L₃₀₆ is about L₃₀₂, and W₃₀₆ may beabout the minimum critical dimension of the pattern layout. The featureportions 306 ₁, 306 ₂, 306 ₃, . . . 306 _(N) accordingly have a lengththat is about the length of the original pattern feature 302, but awidth that is smaller than the original pattern feature 302. The feature306 is then negatively biased to provide a shrunk feature 310, whereeach feature portion 306 ₁, 306 ₂, 306 ₃, . . . 306 _(N) is shrunk tohave a smaller dimension. In the depicted embodiment, an electronproximity correction (EPC) is also performed on the decomposed featureportions of feature 306. Accordingly, feature 310 includes featureportions 310 ₁, 310 ₂, 310 ₃, . . . 310 _(N). Each of the featureportions 310 ₁, 310 ₂, 310 ₃, . . . 310 _(N) have a width (W₃₁₀) that issmaller than the decomposed width, W₃₀₆. W₃₁₀ is about a pixel sizeregistered in an electron beam lithography apparatus, such as theelectron beam lithography apparatus that will be used to form thepattern feature 302 on a material layer. Each of the feature portions310 ₁, 310 ₂, 310 ₃, . . . 310 _(N) also have a length (L₃₁₀) that isabout L₃₀₂. The biased/EPCed pattern feature 310 is then written on amaterial layer using an exposure does that is greater than the exposuredose associated with the pattern feature 302. In other words, anoverexposure is used to write the biased/EPCed pattern feature 310 onthe material layer, thereby forming pattern feature 314 on the materiallayer. The pattern feature 314 corresponds with the pattern feature 302.More specifically, the pattern feature 314 has a dimension, specificallya length (L₃₁₄) and a width (W₃₁₄), that is substantially equivalent tothe dimension, L₃₀₂ and W₃₀₂, of pattern feature 302. The patternfeature 302 is thus formed on the material layer by overexposing thematerial layer to pattern feature 310, which has feature portions withsmaller dimensions than the pattern feature 302.

FIG. 5 illustrates a portion 400 of a pattern layout that is formed on amaterial layer according to the method 100 of FIG. 1. In FIG. 5, thepattern layout includes a pattern feature 402. The pattern feature 402has a dimension, such as a length (L₄₀₂) and a width (W₄₀₂). An exposuredose is associated with the pattern feature 402 that ensures that thepattern feature 402 is written on a material layer with the dimension,L₄₀₂ and W₄₀₂. In the depicted embodiment, the pattern feature 402 isevaluated using block 120 of the method 100 of FIGS. 1 and 2. In thedepicted embodiment, W₄₀₂ is greater than a predetermined threshold size(block 122 of FIG. 2), so the pattern feature 402 is decomposed andbiased to shrink the dimension of the pattern feature 402 (blocks 126and 128 of FIG. 2). For example, the pattern feature 402 is decomposedinto a feature 406 that includes feature portions 406 ₁, 406 ₂, 406 ₃, .. . 406 _(N). Each feature portion 406 ₁, 406 ₂, 406 ₃, . . . 406 _(N)has a dimension, such as a length (L₄₀₆) and a width (W₄₀₆). W₄₀₆ isabout W₄₀₂, and L₄₀₆ may be about the minimum critical dimension of thepattern layout. The feature portions 406 ₁, 406 ₂, 406 ₃, . . . 406 _(N)accordingly have a width that is about the width of the original patternfeature 402, but a length that is smaller than the original patternfeature 402. The feature 406 is then negatively biased to provide ashrunk feature 310, where each feature portion 406 ₁, 406 ₂, 406 ₃, . .. 406 _(N) is shrunk to have a smaller dimension. More specifically, theshrunk feature 406 provides a feature 410 having feature portions 410 ₁,410 ₂, 410 ₃, . . . 410 _(N). Each of the feature portions 410 ₁, 410 ₂,410 ₃, . . . 410 _(N) have a length (L₄₁₀) that is smaller than thedecomposed length, L₄₀₆, and a width (W₄₁₀) that is smaller than thedecomposed width, W₄₀₆. W₄₁₀ is about a pixel size registered in anelectron beam lithography apparatus, such as the electron beamlithography apparatus that will be used to form the pattern feature 402on a material layer. An electron proximity correction (EPC) may beperformed on the shrunk and decomposed feature 410. The biased anddecomposed pattern feature 410 is then written on a material layer usingan exposure does that is greater than the exposure dose associated withthe pattern feature 402. In other words, an overexposure is used towrite the biased pattern feature 410 on the material layer, therebyforming pattern feature 414 on the material layer. The pattern feature414 corresponds with the pattern feature 402. More specifically, thepattern feature 414 has a dimension, specifically a length (L₄₁₄) and awidth (W₄₁₄), that is substantially equivalent to the dimension, L₄₀₂and W₄₀₂, of pattern feature 402. The pattern feature 402 is thus formedon the material layer by overexposing the material layer to patternfeature 410, which has feature portions with smaller dimensions than thepattern feature 402.

FIG. 6 illustrates a portion 500 of a pattern layout that is formed on amaterial layer according to the method 100 of FIG. 1. In FIG. 6, thepattern layout includes a pattern feature 502. The pattern feature 502has a dimension, such as a length (L₅₀₂) and a width (W₅₀₂). An exposuredose is associated with the pattern feature 502 that ensures that thepattern feature 502 is written on a material layer with the dimension,L₅₀₂ and W₅₀₂. In the depicted embodiment, the pattern feature 502 isevaluated using block 120 of the method 100 of FIGS. 1 and 2. In thedepicted embodiment, W₅₀₂ is greater than a predetermined threshold size(block 122 of FIG. 2), so the pattern feature 502 is decomposed andbiased to shrink the dimension of the pattern feature 502 (blocks 126and 128 of FIG. 2). For example, the pattern feature 502 is decomposedinto a feature 506 that includes feature portions 506 ₁, 506 ₂, 506 ₃, .. . 506 _(N). Each feature portion 506 ₁, 506 ₂, 506 ₃, . . . 506 _(N)has a dimension, such as a length (L₅₀₆) and a width (W₅₀₆). L₄₀₆ is maybe about the minimum critical dimension of the pattern layout, and W₄₀₆may be about the minimum critical dimension of the pattern layout. Thefeature portions 506 ₁, 506 ₂, 506 ₃, . . . 506 _(N) accordingly have awidth that is smaller than the width of the original pattern feature502, and a length that is smaller than the length of the originalpattern feature 502. The feature 506 is then negatively biased toprovide a shrunk feature 510, where each feature portion 506 ₁, 506 ₂,506 ₃, . . . 506 _(N) is shrunk to have a smaller dimension. Morespecifically, the shrunk feature 506 provides feature 510 having featureportions 510 ₁, 510 ₂, 510 ₃, . . . 510 _(N). Each of the featureportions 510 ₁, 510 ₂, 510 ₃, . . . 510 _(N) have a length (L₅₁₀) thatis smaller than the decomposed length, L₅₀₆, and a width (W₅₁₀) that issmaller than the decomposed width, W₅₀₆. L₅₁₀ and W₅₁₀ are about a pixelsize registered in an electron beam lithography apparatus, such as theelectron beam lithography apparatus that will be used to form thepattern feature 502 on a material layer. An electron proximitycorrection (EPC) may be performed on the shrunk and decomposed feature510. The biased and decomposed pattern feature 510 is then written on amaterial layer using an exposure does that is greater than the exposuredose associated with the pattern feature 502. In other words, anoverexposure is used to write the biased pattern feature 510 on thematerial layer, thereby forming pattern feature 514 on the materiallayer. The pattern feature 514 corresponds with the pattern feature 502.More specifically, the pattern feature 514 has a dimension, specificallya length (L₄₅₁₄) and a width (W₅₁₄), that is substantially equivalent tothe dimension, L₅₀₂ and W₅₀₂, of pattern feature 502. The patternfeature 502 is thus formed on the material layer by overexposing thematerial layer to pattern feature 510, which has feature portions withsmaller dimensions than the pattern feature 502.

FIG. 7 is a simplified block diagram of a lithography apparatus 600according to various aspects of the present disclosure. In the depictedembodiment, the lithography apparatus 600 is an electron beamlithography apparatus. The lithography apparatus 600 can implement themethod 100 of FIG. 1 to write a pattern, such as an integrated circuitpattern, on a wafer. The wafer is a semiconductor substrate, a maskblank, a glass substrate, a flat panel substrate, or other suitablesubstrate. The wafer may include a recording medium, such as an energysensitive resist (or material) layer, formed thereon. FIG. 7 has beensimplified for the sake of clarity to better understand the inventiveconcepts of the present disclosure. Additional features can be added inthe lithography apparatus 600, and some of the features described belowcan be replaced or eliminated for additional embodiments of thelithography apparatus 600.

In the depicted embodiment, the lithography apparatus includes anelectron beam data processing module 610 and an electron beam exposuremodule 620. The electron beam data processing module 610 and theelectron beam exposure module 620 are in communication with one another.The electron beam data processing module 610 is configured to readpatterning data from a data storage medium, which may be within theelectron beam data processing module 610, or remotely positioned and incommunication with the electron beam data processing module 610. Theelectron beam data processing module 610 obtains or receives thepatterning data and can load it into a memory associated with theelectron beam data processing module 610. In the depicted embodiment,the patterning data includes a pattern layout, such as an IC designlayout as described above. The electron beam data processing module 610includes a pattern generator that processes the patterning data andgenerates a pattern writing instruction set, for example, a patternwriting set associated with the pattern layout. The electron beam dataprocessing module 610 is also configured to reduce a pattern density ofa pattern, for example, by using the method 100 of FIG. 1. The patterngenerator that processes the patterning data and generates a patternwriting instruction set can also generate patterning data and a patternwriting instruction set associated with the pattern having the reducedpattern density. The electron beam data processing module 610 sends thewriting instruction set to the electron beam exposure module 620.Additionally, the electron beam data processing module 610 may electronperform proximity correction and transformation to the writinginstruction for the electron beam exposure module 620. Alternatively,the proximity correction and transformation may optionally be performedseparately by a standalone module.

The electron beam exposure module 620 includes a source that isconfigured to generate at least one charged particle beam. In thedepicted embodiment, since the lithography apparatus 600 is an electronbeam lithography apparatus 600, the charged particle beam is an electronbeam. Alternatively, the charged particle beam may be a photon beam orion beam. The charged particle beam may pass through one or more lenses(not shown). In an example, the charged particle beam may pass throughthe one or more lenses and may be focused to a beam aperture portionconfigured with a plurality of apertures or openings that split thecharged particle beam into a plurality of beams. The number of beams mayvary depending on design requirements of the lithography apparatus. Thecharged particle beam may be a Gaussian beam or a plurality of Gaussianbeam. The charged particle beam may travel to a beam controller that isconfigured to allow one or more of the beams to pass through to animaging head, or to block/blank one or more of the beams from passingthrough to the imaging head. The imaging head may include an electronoptical system for focusing the beams that are allowed to pass through.The beam controller may include a plurality of deflectors (also referredto as blankers) that are controlled by electrical control signals thatare associated with the writing instructions sent from the electron beamdata processing module 610.

The electron beam exposure module 620 may further include a controllerthat receives the writing instructions from the DPU 102. The writinginstructions may be sent using light radiation as carriers of theinformation. The lithography apparatus 600 further includes a stage (notshown) that is configured to move in various directions. The stage mayhold and secure a wafer by a vacuum system or other suitable securingmechanism. During processing, the wafer is moved or scanned relative tothe imaging head and in cooperation with the controller. The chargedparticle beam is focused, by the lithography apparatus 600, onto therecording medium such that the pattern layout is written directly intothe recording medium, without a photomask or reticle. In the depictedembodiment, as described above, the pattern layout having the shrunkpattern layout dimension is written directly into the recording medium,using an exposure dose that is greater than the exposure dose associatedwith the pattern layout having the originally designed pattern layoutdimension. After the entire wafer has been scanned, the recording mediummay be developed to form the pattern over the wafer, and otherprocessing, such as etching and doping, may be performed using thepatterned recording medium. It is understood that the lithographyapparatus 600 may include other components such as an alignment systemand collimator, but is simplified for a better understanding of thedisclosed embodiments herein.

The present disclosure provides for many different embodiments. Forexample, a method includes receiving a pattern layout having a pluralityof features, wherein an exposure dose is associated with the patternlayout; biasing the pattern layout such that a size of each of theplurality of features is reduced to a pixel size registered in anelectron-beam apparatus; and exposing a material layer to the biasedpattern layout using the electron-beam apparatus, wherein the exposinguses a greater exposure dose than the exposure dose associated with thepattern layout, thereby forming the pattern layout on the materiallayer.

Biasing the pattern layout may include shrinking each of the pluralityof features according to critical dimension bias. In an example, biasingthe pattern layout includes reducing the size of each of the pluralityof features to a size that is about 0.1 to about 0.8 times a minimumcritical dimension of the pattern layout. Biasing the pattern layout mayinclude, for each of the plurality of features determining whether asize of the feature is greater than a threshold size before biasing thepattern layout, and if the size of the feature is greater than thethreshold size, decomposing the feature to have more than one featureportion, wherein each feature portion is smaller than or equal to thethreshold size. In an example, the threshold size is less than two timesa minimum critical dimension of the pattern layout.

The method may further include performing an electron proximitycorrection on the biased pattern layout before exposing the materiallayer, and/or determining the exposure dose associated with the patternlayout. Using a greater exposure dose than the exposure dose associatedwith the pattern layout may include determining the greater exposuredose based on the shrunk pattern layout. In an example, forming thepattern layout on the material layer includes forming an integratedcircuit pattern on the material layer.

In another example, a method includes receiving a pattern layout havinga pattern layout dimension; shrinking the pattern layout dimension; andoverexposing a material layer to the shrunk pattern layout dimension,thereby forming the pattern layout having the pattern layout dimensionon the material layer. Shrinking the pattern layout dimension mayinclude reducing a pattern density of the pattern layout. In an example,the pattern layout dimension is a critical dimension, and shrinking thepattern layout dimension includes reducing the critical dimension. Themethod may further include determining whether the critical dimension isgreater than a threshold value before reducing the critical dimension,and if the critical dimension is greater than the threshold value,decomposing the pattern layout to have a critical dimension less thanthe threshold value. The method may further include performing anelectron proximity correction to the pattern layout having the shrunkpattern layout dimension. In an example, an exposure dose is associatedwith the pattern layout having the pattern layout dimension, andoverexposing the material layer to the shrunk pattern layout dimensionincludes using an exposure dose that is greater than the exposure doseassociated with the pattern layout having the pattern layout dimension.

In an example, the pattern layout includes a plurality of features, andshrinking the pattern layout dimension includes shrinking a dimension ofeach of the plurality of features to a pixel size registered in anelectron beam tool. Shrinking a dimension of each of the plurality offeatures to a pixel size registered in the electron beam tool mayinclude, for each of the plurality of features determining a criticaldimension of the feature; if the critical dimension is less than athreshold value, shrinking the feature to the pixel size registered inthe electron beam tool; and if the critical dimension is larger than orequal to the threshold value, decomposing the feature into more than onefeature portion having a critical dimension less than the thresholdvalue and shrinking each of the more than one feature portion to thepixel size registered in the electron beam tool.

An electron beam apparatus is also provided that includes an electronbeam exposure module and an electron beam data processing module incommunication with the electron beam exposure module. The electron beamdata processing module programmed to receive a pattern layout having apattern layout dimension, shrink the pattern layout dimension, anddetermine an exposure dose that is greater than an exposure doseassociated with the pattern layout having the pattern layout dimension,such that the electron beam exposure module uses the shrunk patternlayout dimension and the determined exposure dose for forming thepattern layout having the pattern layout dimension on a material layer.The electron beam data processing module may be programmed to determinethe exposure dose associated with the pattern layout having the patternlayout dimension. Shrinking the pattern layout dimension may beconfigured to shrink a pattern density of the pattern layout.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1. A method comprising: receiving a pattern layout having at least onefeature; converting the at least one feature into a biased feature thathas a plurality of sub-features; and writing an energy sensitivematerial layer according to the biased feature, thereby forming the atleast one feature in the energy sensitive material layer.
 2. The methodof claim 1 wherein the writing includes writing the energy sensitivematerial layer according to the biased feature using a greater writingdose than a writing dose associated with the at least one feature. 3.The method of claim 1 wherein the converting the at least one featureincludes biasing the at least one feature such that a size of each ofthe plurality of sub-features is reduced to a pixel size registered inan electron beam apparatus.
 4. The method of claim 3 wherein the biasingthe at least one feature such that the size of each of the plurality ofsub-features is reduced to the pixel size registered in the electronbeam apparatus includes reducing the size of each of the plurality ofsub-features to a size that is about 0.1 to about 0.8 times a minimumcritical dimension of the pattern layout.
 5. The method of claim 3wherein the biasing the at least one feature such that the size of eachof the plurality of sub-features is reduced to the pixel size registeredin the electron beam apparatus includes shrinking each of the pluralityof sub-features according to critical dimension bias.
 6. The method ofclaim 1 wherein the converting the at least one feature includesconverting each of a plurality of features into a biased feature,wherein the converting for each of the plurality of features includes:before converting the feature, determining whether a size of the featureis greater than a threshold size; and if the size of the feature isgreater than the threshold size, decomposing the feature to have theplurality of sub-features, wherein each sub-feature is smaller than orequal to the threshold size.
 7. The method of claim 6 wherein thethreshold size is less than two times a minimum critical dimension ofthe pattern layout.
 8. The method of claim 1 further includingperforming an electron proximity correction on the biased feature beforewriting the energy sensitive material layer.
 9. The method of claim 1further including determining the writing dose associated with the atleast one feature.
 10. A method comprising: receiving a pattern layouthaving a first feature and a second feature; decomposing the firstfeature into a plurality of first sub-features; shrinking the secondfeature and the plurality of first sub-features; and writing a materiallayer according to the shrunk second feature and plurality of firstsub-features, thereby forming the first feature and the second featureon the material layer.
 11. The method of claim 10 wherein thedecomposing and shrinking includes reducing a pattern density of thepattern layout.
 12. The method of claim 10 wherein: the pattern layouthas a critical dimension; and the shrinking the second feature and theplurality of first sub-features includes reducing the criticaldimension.
 13. The method of claim 10 wherein the shrinking includesshrinking a dimension of the second feature and each of the plurality offirst sub-features to a pixel size registered in an electron beam tool.14. The method of claim 10 further including: determining that acritical dimension of the first feature is greater than or equal to athreshold value before decomposing the first feature; and determiningthat a critical dimension of the second feature has a critical dimensionless than the threshold value before shrinking the second feature. 15.The method of claim 14 wherein the decomposing the first feature intothe plurality of first sub-features includes decomposing the firstfeature into the plurality of first sub-features, wherein eachsub-feature has a dimension that is less than the threshold value. 16.The method of claim 10 further including performing an electronproximity correction to the shrunk second feature and the shrunkplurality of first sub-features.
 17. The method of claim 10 wherein: awriting dose is associated with the first feature and the secondfeature; and the writing the material layer according to the shrunksecond feature and the plurality of first sub-features includes using awriting dose that is greater than the writing dose associated with thesecond feature and first feature, respectively.
 18. An electron beamapparatus comprising: an electron beam data processing module programmedto: receive a pattern layout having a feature, decompose the featureinto a plurality of sub-features, and shrink the plurality ofsub-features, thereby forming a biased feature; and an electron beammodule in communication with the electron beam data processing moduleand designed to provide an electron beam for electron-beam writingaccording to the biased feature.
 19. The electron beam apparatus ofclaim 18 wherein the electron beam data processing module is programmedto determine the writing dose associated with the biased feature. 20.The electron beam apparatus of claim 18 wherein the electron beam dataprocessing module is programmed to shrink a pattern density of thepattern layout.